SMBB Technology: improves module power output and reliability through better light trapping and current collection

Hot 2.0 Technology: enhances reliability and reduces LID/LETID in N-type modules

PID Resistance: optimized mass-production process and materials control guarantee excellent Anti-PID performance

Enhanced Mechanical Load: certified to withstand high wind and snow loads (2400 Pascal and 5400 Pascal respectively)

Durability Against Extreme Environmental Conditions: high resistance to salt mist and ammonia